KUALA LUMPUR, 21 May 2026 (The Capital Post) — Malaysia’s Ministry of Education (KPM) has signed a Memorandum of Understanding (MoU) with Multimedia University (MMU) and Huawei Malaysia for the implementation of a TVET-AI programme in Fully Residential Schools (SBP) beginning this year.
The MoU was signed by Education Ministry Secretary-General Wan Hashim Wan Rahim, MMU President and Chief Executive Officer Professor Dato’ Dr. Mazliham Mohd Su’ud, and Huawei Malaysia Chief Executive Officer Simon Sun.
The signing ceremony was witnessed by Education Minister Fadhlina Sidek.
According to the ministry, the TVET-AI initiative will provide students with opportunities to obtain the Huawei Certified ICT Associate – Artificial Intelligence (HCIA-AI) professional certification as preparation for future industry demands.
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The programme is expected to strengthen students’ exposure to artificial intelligence, digital skills and Technical and Vocational Education and Training (TVET) in line with the nation’s efforts to develop a future-ready workforce.
The information was shared via the official Facebook page of Kementerian Pendidikan Malaysia. – The Capital Post
